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Transfer moulding is a flexible technology that combines polymer charge transfer with aspects of compression moulding. Using this technique, a polymer charge is first introduced into a transfer vessel and then moved into the mould. The cooled mould, which still contained the polymer, forms the moulded portion, which is then removed. Many different things, including integrated circuits, plugs, connections, pins, coils, and studs, are encapsulated using this procedure. Additionally, ceramic or metal inserts can be added to the mould cavity using transfer moulding. The heated polymer creates a solid bond with the inserted surface as it fills up the mould.